Flow-through heat transfer apparatus with movable thermal via

Details Flow-through heat transfer apparatus with movable thermal via Flow-through heat transfer apparatus with movable thermal via

1990-07-20

1991-09-10

Ford, John

Heat exchange

Flexible envelope or cover type

165 804, 361385, 357 82, F24D 1902, F28F 500, H01L 2504

Patent

active

050465520

ABSTRACT:
A heat transfer apparatus especially useful for cooling electronic components has a frame with a channel for the flow of heat transfer liquid, a flexible sheet connected to the frame, and a thermal via coupled to the sheet. As fluid flows through the channel, the sheet and via move outwardly for contact with the component to be cooled. A cover structure extends across the frame adjacent the via and limits outward movement of the sheet. The cover structure also prevents damage to the sheet when the apparatus is handled.

REFERENCES:
patent: 4067042 (1978-01-01), Novak et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4155402 (1979-05-01), Just
patent: 4381032 (1983-04-01), Cutchaw
patent: 4551787 (1985-11-01), Mittal et al.
patent: 4777561 (1988-10-01), Murphy et al.
patent: 4791983 (1988-12-01), Nicol et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
IBM Technical Disclosure Bulletin, vol. 29, No. 3, (Aug. 1985).
Reprint from Electronic Products magazine, Jan., 1989.

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