Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-29
2008-01-29
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S692000, C361S714000, C361S715000, C165S080300, C165S104330
Reexamination Certificate
active
07324336
ABSTRACT:
A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.
REFERENCES:
patent: 3648113 (1972-03-01), Rathjen et al.
patent: 3956673 (1976-05-01), Seid
patent: 4006388 (1977-02-01), Bartholomew
patent: 4186422 (1980-01-01), Laermer
patent: 4442475 (1984-04-01), Franklin et al.
patent: 4829402 (1989-05-01), Gewebler et al.
patent: 5019939 (1991-05-01), Reimer
patent: 5034852 (1991-07-01), Rosenberg
patent: 5420753 (1995-05-01), Akamatsu et al.
patent: 5424916 (1995-06-01), Martin
patent: 5482109 (1996-01-01), Kunkel
patent: 5825621 (1998-10-01), Giannatto et al.
patent: 5910884 (1999-06-01), Garza et al.
patent: 5940266 (1999-08-01), Hamilton et al.
patent: 6052284 (2000-04-01), Suga et al.
patent: 6055157 (2000-04-01), Bartilson
patent: 6058010 (2000-05-01), Schmidt et al.
patent: 6212075 (2001-04-01), Habing et al.
patent: 6272012 (2001-08-01), Medin et al.
patent: 6304447 (2001-10-01), Bortolini et al.
patent: 6366461 (2002-04-01), Pautsch et al.
patent: 6381147 (2002-04-01), Hayward et al.
patent: 6404640 (2002-06-01), Ishimine et al.
patent: 6430044 (2002-08-01), Hutchinson et al.
patent: 6462949 (2002-10-01), Parish, IV et al.
patent: 6483700 (2002-11-01), Malone et al.
patent: 6496375 (2002-12-01), Patel et al.
patent: 6621706 (2003-09-01), Tzlil et al.
patent: 6768642 (2004-07-01), Hines et al.
patent: 6776221 (2004-08-01), Montgomery et al.
patent: 6781831 (2004-08-01), Banton et al.
patent: 6796372 (2004-09-01), Bear
IBM “Cold Plate for Thermal Conduction Module With Reduced Water Flow Resistance, Increase Fin Area, And Improved Water Turbulence” Technical Disclosure Bulletin vol. 29, No. 2, Jul. 1986, pp. 689-690.
IBM “High-Power Electronic Package” Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, pp. 4393-4398.
Draft Standard entitled “Mechanical Specifications for Microcomputers Using Enhanced Ruggedized Design Implementation(ERDI)”, VITA 48.0, Revision D0.1a, Jul. 14, 2004, VITA Standards Organization, Fountain Hills, AZ, pp. 1-33.
Larcheveque Jon
Stutzman Randall J.
Urda Eugene J.
Vos David L.
Datskovskiy Michael
Lockheed Martin Corporation
Wolf Greenfield & Sacks P.C.
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