Flow soldering apparatus

Details Flow soldering apparatus Flow soldering apparatus

2003-10-29

2008-08-26

Lorengo, Jerry (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S036000, C210S767000, C210S799000, C068S208000

Reexamination Certificate

active

07416103

ABSTRACT:
A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle1, a secondary jet nozzle2, and a pump (not shown) forming jet waves24, 25are installed in a solder tank6reservoiring molten solder S. Guide plates4, 5are installed between the jet nozzles1, 2above a solder face F of the molten solder S on a position where the molten solder is dropped. The guide plates4, 5formed into a V-shape are provided with solder guide portions crossing each other so as to drop the molten solder S at different positions on the solder face F of the solder tank6. Molten solder dropped onto upper portions of the guide plates4, 5passes through the solder guide portions and is made to fall on a nozzle side different to a nozzle side where the solder is flowed.

REFERENCES:
patent: 5156324 (1992-10-01), Hueste et al.
patent: 5379931 (1995-01-01), Van Schaik
patent: 5769305 (1998-06-01), Takeda et al.
patent: A 05-305432 (1993-11-01), None
patent: A 09-47866 (1997-02-01), None

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