Measuring and testing – Volume or rate of flow – Thermal type
Reexamination Certificate
2008-07-29
2008-07-29
Patel, Harshad (Department: 2855)
Measuring and testing
Volume or rate of flow
Thermal type
Reexamination Certificate
active
07404320
ABSTRACT:
The present invention provides a technology capable of achieving a highly-sensitive flow sensor, by forming a metal film having a relatively high TCR on a semiconductor substrate via an insulating film. A measurement device which is a thermal fluid flow sensor includes a heat element, resistance temperature detectors (upstream-side resistance temperature detector and downstream-side resistance temperature detector), and a resistance temperature detector for air which are all formed of a first metal film. The first metal film is formed of an α-Ta film having a resistivity lower than three times the resistivity of a Ta ingot and obtained by deposition through sputtering on an amorphous film containing metal.
REFERENCES:
patent: 4478076 (1984-10-01), Bohrer
patent: 4884443 (1989-12-01), Lee et al.
patent: 4888988 (1989-12-01), Lee et al.
patent: 4966037 (1990-10-01), Sumner et al.
patent: 5006421 (1991-04-01), Yang et al.
patent: 5281485 (1994-01-01), Colgan et al.
patent: 6096127 (2000-08-01), Dimos et al.
patent: 6450025 (2002-09-01), Wado et al.
patent: 2003/0108664 (2003-06-01), Kodas et al.
patent: 2006/0267724 (2006-11-01), Parsons
patent: 0 245 092 (1987-05-01), None
patent: 05-223613 (1992-02-01), None
patent: 06-230021 (1993-02-01), None
patent: 06-300605 (1993-04-01), None
patent: 06-317440 (1993-05-01), None
patent: 07-190822 (1993-12-01), None
patent: 08-054269 (1994-08-01), None
patent: 10-213470 (1997-01-01), None
“Resistance Change in Thin Ag Film on Si (100)”, Jpn. J. Appl. Phys. vol. 42 (2003) pp. 6532-6534; Motonobu et al. Osaka, Japan, Oct. 10, 2003.
European Search Report dated Feb. 13, 2007.
Fukuda Hiroshi
Sakuma Noriyuki
Takeda Ken'ichi
Yamamoto Naoki
A. Marquez, Esq. Juan Carlos
Fisher Esq. Stanley P.
Hitachi , Ltd.
Patel Harshad
Reed Smith LLP
LandOfFree
Flow sensor using a heat element and a resistance... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flow sensor using a heat element and a resistance..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flow sensor using a heat element and a resistance... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2800422