Flow-over mass soldering

Details Flow-over mass soldering Flow-over mass soldering

1976-03-25

1977-03-15

Jones, Jr., James L.

Metal fusion bonding

Process

Plural joints

228 37, 228257, H05K 334

Patent

active

040119807

ABSTRACT:
A printed wiring board is oriented with a wiring surface facing up for mass soldering. Molten solder is pumped from a tank onto a trough and flows in a thin, wide stream across the upper surface of the printed wiring board which is held down to prevent the board from floating on top of the solder.

REFERENCES:
patent: 3921888 (1975-11-01), Elliott et al.

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