Flow molding means and method

Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion

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Details

219 1081, 264337, 264338, B29C 102, B29C 1700, H05B 900

Patent

active

039377741

ABSTRACT:
Thermosetting molds are formed with electrically conductive surfaces for use in high frequency energy flow molding of sheet materials. Preferably the mold of this invention has a highly electrically conductive layer preferably in an epoxy gel coat carrying electrically conductive particles of gold, silver or platinum and positioned over a compatible epoxy mold body. A vacuum molding technique is used to obtain good surface definition in surface molding.

REFERENCES:
patent: 2946713 (1960-07-01), Dusina, Jr. et al.
patent: 3167521 (1965-01-01), Heckmaier et al.
patent: 3417175 (1968-12-01), Brown et al.
patent: 3429359 (1969-02-01), Hollingsworth
patent: 3444275 (1969-05-01), Willett
patent: 3791906 (1974-02-01), Farkas

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