Flow-inducing panels for electroless copper plating of complex a

Details Flow-inducing panels for electroless copper plating of complex a Flow-inducing panels for electroless copper plating of complex a

1994-07-21

1997-02-18

Lamb, Brenda A.

Coating apparatus

Work holders, or handling devices

204297W, B05C 1300

Patent

active

056037686

ABSTRACT:
Flow-inducing panels for use in electroless copper plating of complex plastic microwave assemblies. A panel comprises a rigid baffle having openings adapted to secure microwave assemblies therein. The panel has a size relative to the electroless copper plating tank that causes sufficient plating solution flow through the channels in the microwave assemblies by minimizing solution flow bypassing of the channels. This achieves complete copper plating of the inner surfaces in the channels. A relatively large panel builds up back pressure as it approaches plating tank walls, which creates a pressure differential as it moves through the plating tank, thus forcing solution through the channels. The flow-inducing panels easily hold many parts in a stabilized manner which yields high productivity, and provide solution flow through the channels using a standard metallization basket used for printed wiring board manufacturing.

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