Flotation method for orienting chips in the manufacture of surfa

Details Flotation method for orienting chips in the manufacture of surfa Flotation method for orienting chips in the manufacture of surfa

1983-03-07

1985-11-12

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156246, 156302, 156305, 156278, 427222, 427348, 264112, 264128, 264298, B32B 516

Patent

active

045526060

ABSTRACT:
A substantially non-overlapping tightly packed layer of plastic chips is formed and attached to the surface of a substrate by a method in which the chips are dispersed onto the surface of a liquid, flowing from a first location to a second location. The rate of flow of the surface of the liquid is reduced at the second location to cause the chips to pack together in a single-chip-thickness layer. The layer of chips is then removed from the liquid by passing a porous web upward at an angle from below the liquid surface through the chip layer-liquid interface. The chip layer is then transferred to a heat-sensitive transparent adhesive coating on a suitable prepared substrate and secured thereon by means of heat and pressure. A resinous wear layer which is transparent after fusion is then applied. Prior to fusion of the wear layer, it may be passed beneath a smoothing blade or, if a more embossed surface texture is desired, beneath an air knife to move some of the resinous wear layer material from between the chips onto the surfaces thereof.

REFERENCES:
patent: 3056224 (1962-10-01), Almy et al.
patent: 3150022 (1964-09-01), Vida
patent: 3551244 (1970-12-01), Forester et al.
patent: 3661662 (1972-05-01), Allen
Rickard, T. A., Concentration by Flotation, John Wiley and Sons, N.Y., 1921, pp. 45-49, TN 523R45.

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