Flooring material for wiring

Details Flooring material for wiring Flooring material for wiring

1994-12-07

1996-02-06

Ahmad, Nasser

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

522208, 428 41, 428 42, 428137, 428138, 428167, 428354, 428285, 428286, 428457, 4285371, 4285375, E04F 1518, H02G 326

Patent

active

054894581

ABSTRACT:
A flooring material is composed by interpositioning at least one intermediate layer (2), in the form of a sheet that is weakly adhered to a sheet base material (1) to an extent that at least its upper surface can be easily peeled from said sheet base material (1), within said sheet base material corresponding to the bottoms of wiring grooves (6 and 7) formed in said sheet base material (1). A plurality of cuts are made along cut lines (4 and 5) of said flooring material at a depth that extends to the above-mentioned intermediate layer (2) at prescribed intervals. Wiring grooves (6 and 7) are formed by peeling off portions (1a and 1b) of the sheet base material (1) within said cut lines to enable wiring along said grooves (6 and 7).

REFERENCES:
patent: 4983438 (1991-01-01), Jameson
patent: 5310589 (1994-05-01), Nagashima

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