Floor tile and floor

Details Floor tile and floor Floor tile and floor

1988-04-28

1990-08-07

Scherbel, David A.

Static structures (e.g., buildings)

Relatively yieldable preformed separator

Separator inserted prior to or during pouring of two...

52480, 404 31, 404 32, E04F 1522

Patent

active

049456970

ABSTRACT:
A floor or walkway has a base and an overlay on the base. The overlay includes a plurality of prefabricated tiles each of which has an upper layer designed to contact objects on the floor or walkway and a lower layer designed to bear against the base. The upper layers are composed of a ceramic while the lower layers are composed of a resilient material having anti-skid characteristics. The upper and lower layers of each tile are adhesively secured or vulcanized to one another during manufacture of the tile. The overlay is formed by simply placing the tile on the base or loosely securing the tiles to the base by means of an adhesive. If the overlay is outdoors, the same or gaps between neighboring tiles are kept open to permit water runoff. The lower layers of the tiles are then formed with drainage channels and/or open pores for the discharge of water which has passed through the seams or gaps. The opens seams or gaps in combination with the resilience of the lower layers allows the upper layers to shift vertically relative to one another so that the overlay can adapt to irregularities in the base. If the overlay is indoors where water is of no concern, the seams or gaps between neighboring tiles may be filled. The filling is flexible in order to permit relative vertical shifting of the upper layers of the tiles.

REFERENCES:
patent: 3041785 (1962-07-01), MacDonald et al.
patent: 3817012 (1974-06-01), Wack et al.
patent: 3902293 (1975-09-01), Witt et al.
patent: 4411113 (1983-10-01), Zimmermann
patent: 4415616 (1983-11-01), Angioletti
patent: 4432177 (1984-02-01), Amesso et al.
patent: 4468592 (1987-03-01), Harinishi
patent: 4567704 (1986-02-01), Bernett et al.
patent: 4637184 (1987-01-01), Radtke et al.

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