Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1986-11-20
1987-12-29
Godici, Nicholas P.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
2281802, 228 62, B23K 3704
Patent
active
047155264
ABSTRACT:
Apparatus and method for providing a floating seal for an inert gas solder reflow chamber. The seal floats with respect to upper and lower chucks and is made of a substantially non-deformable material. The seal permits lateral, axial and rotational movement between the lower and upper chucks while facilitating accurate control of bonding pressure. The structure of this floating seal permits use of seal materials which facilitate use of higher melting point solders, some in excess of 350.degree. C., for flip-chip bonding.
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Cuda Carmine
General Dynamics Pomona Division
Godici Nicholas P.
Johnson Edward B.
Maxham Lawrence A.
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