Flipped method for characterization of epitaxial layers

Details Flipped method for characterization of epitaxial layers Flipped method for characterization of epitaxial layers

1977-01-12

1978-10-10

Dost, Gerald A.

Metal working

Method of mechanical manufacture

Assembling or joining

B01J 1700

Patent

active

041188578

ABSTRACT:
A flipped layer method is used to characterize epitaxial layers on a first ubstrate. A second substrate is attached to the epitaxial layer, and the first substrate and a portion of the epitaxial layer are then removed. Measurements are then performed on the remaining portion of the epitaxial layer.

REFERENCES:
patent: 3574926 (1971-04-01), Le Men
patent: 3619283 (1971-11-01), Carpenter
patent: 3647581 (1972-03-01), Mash
patent: 3902979 (1975-09-01), Thomas

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