Flip substrate for chip mount

Details Flip substrate for chip mount Flip substrate for chip mount

1990-02-12

1991-08-13

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437203, 437209, H01L 2316

Patent

active

050396285

ABSTRACT:
A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more density since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.

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Blodgett, "Microelectronic Packaging", Scientific American, Jul. 1983, pp. 86-96.
"TAB Technology Tackles High Density Interconnections", Electronic Packaging & Production, Dec. 1984, pp. 34-39.

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