Flip interconnect

Details Flip interconnect Flip interconnect

1991-05-07

1992-09-29

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437220, 357 72, 357 80, H01L 2160

Patent

active

051513889

ABSTRACT:
Interconnection of densely populated multiple chip integrated hybrid circuits (12) in a manner such that heat can be efficiently extracted therefrom. An integrated circuit die (31) is attached to a flip chip interconnect layer by soldering the connection pads thereto. The interconnect layer is slid off its substrate (11) in the manner of a decal. After the circuit has been tested and found acceptable, the other side of the die (31) is permanently bonded to a thermal conduction plate or heat sink (32). The decal interconnect (33) is made of alternating layers of an insulator (41) and a conductor (42) built on top of an erodible sacrifical layer (48) applied to a substrate. The sacrificial layer (48) is dissolved by a suitable solvent to float the multilayer interconnect off the substrate (11).

REFERENCES:
patent: 4709468 (1987-12-01), Wilson
patent: 4784972 (1988-11-01), Hatada
patent: 4795512 (1989-01-01), Nattatani et al.
patent: 4926241 (1990-05-01), Carey

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