Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2007-04-12
2010-02-09
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C257S795000, C257S783000
Reexamination Certificate
active
07659151
ABSTRACT:
A device is disclosed which includes a die comprising an integrated circuit and an interposer that is coupled to the die, the interposer having a smaller footprint than that of the die. A method is disclosed which includes operatively coupling an interposer to a die comprising an integrated circuit, the interposer having a smaller footprint than that of the die, and filling a space between the interposer and the die with an underfill material.
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Corisis David J.
Jiang Tongbi
Lee Calvin
Micro)n Technology, Inc.
Perkins Coie LLP
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