Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-10-18
2005-10-18
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C222S052000, C222S146100, C118S666000, C118S712000
Reexamination Certificate
active
06955946
ABSTRACT:
A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.
REFERENCES:
patent: 3994256 (1976-11-01), Moen
patent: 4271092 (1981-06-01), Sullivan et al.
patent: 4406247 (1983-09-01), Baughman et al.
patent: 4431690 (1984-02-01), Matt et al.
patent: 4470369 (1984-09-01), Edgerton
patent: 4620893 (1986-11-01), Parrens
patent: 4666732 (1987-05-01), Schucker
patent: 4667852 (1987-05-01), Siemann
patent: 4682710 (1987-07-01), Turner, Jr. et al.
patent: 4682711 (1987-07-01), Reighard et al.
patent: 4787332 (1988-11-01), Geisel et al.
patent: 4891249 (1990-01-01), McIntyre
patent: 4935261 (1990-06-01), Srivastava et al.
patent: 4987854 (1991-01-01), Hall
patent: 5052338 (1991-10-01), Maiorca et al.
patent: 5175018 (1992-12-01), Lee et al.
patent: 5208064 (1993-05-01), Becker et al.
patent: 5263608 (1993-11-01), Kieman et al.
patent: 5271521 (1993-12-01), Noss et al.
patent: 5322706 (1994-06-01), Merkel et al.
patent: 5348604 (1994-09-01), Neff
patent: 5377961 (1995-01-01), Smith et al.
patent: RE35010 (1995-08-01), Price
patent: 5437727 (1995-08-01), Yoneda et al.
patent: 5510149 (1996-04-01), Schucker
patent: 5554224 (1996-09-01), Foltyn
patent: 5558504 (1996-09-01), Stridsberg
patent: 5711989 (1998-01-01), Ciardella et al.
patent: 5906682 (1999-05-01), Bouras et al.
patent: 5935375 (1999-08-01), Nakazawa et al.
patent: 6173864 (2001-01-01), Reighard et al.
patent: 6213347 (2001-04-01), Thomas
patent: 0403280 (1990-12-01), None
patent: 63299191 (1968-12-01), None
patent: 61146541 (1986-07-01), None
patent: 1184078 (1989-07-01), None
patent: 2184366 (1990-07-01), None
patent: 02303571 (1990-12-01), None
patent: 2303571 (1990-12-01), None
patent: 3296461 (1991-12-01), None
patent: 4244257 (1992-09-01), None
patent: 57815 (1993-01-01), None
patent: 5283478 (1993-06-01), None
patent: 5211202 (1993-08-01), None
patent: 6029334 (1994-02-01), None
patent: 669286 (1994-03-01), None
patent: 6169157 (1994-06-01), None
patent: 6170301 (1994-06-01), None
patent: 775870 (1995-03-01), None
patent: 63141240 (1998-06-01), None
James E. DeVries,Dispensing and Application Equipment for Adhesives and Sealants, ASM International, pp. 693-702, 1991.
Asymtek,A-600 Dispensepro™, Brochure, Aug. 1991 (6 pages).
Asymtek,Three Fully Automated Fluid Dispensing Product Lines, Press Release, Feb. 1992 (3 pages).
Asymtek,AV-2000 Automatic Fiducial Locator, Brochure, undated (1 page).
Asymtek,A-618C Automated Fluid Dispensing System, Brochure, undated (4 pages).
Herb Turner,Automation and Robotics for Adhesives and Sealants Use, ASM International, pp. 716-725, 1991.
Herb Turner,Robotic Dispensing of Cold Sealants and Adhesives New Developments, Nordson Corporation, 1988.
Brochure, Nordson Corporation,Pro-Flo System, 1995.
Brochure, Nordson Corporation,Flo Melt System, 1984.
Robotics World,Flexible Automation—Intelligent Machines, May/Jun. 1989.
Request for Quotation datedNov. 16, 1992 (8 pages).
Ayymtek,Process Notes for Successful Encapsulation and Underfilling in MCM Assembly, Nov. 1994 (4 pages).
Asymtek,The EN-600 Encapsulant System, Brochure, Mar. 1993 (2 pages).
Babiarz Alec J.
Bouras Carlos E.
La. Duong T.
Lewis Alan R.
Meier Mark S.
Chambliss Alonzo
Nordson Corporation
Wood Herron & Evans L.L.P.
LandOfFree
Flip chip underfill system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flip chip underfill system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip underfill system and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3482328