Flip-chip type semiconductor device, production process for...

Details Flip-chip type semiconductor device, production process for... Flip-chip type semiconductor device, production process for...

2007-07-03

2007-07-03

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S113000, C438S460000, C257SE21499

Reexamination Certificate

active

10919411

ABSTRACT:
A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.

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patent: 6207473 (2001-03-01), Hirai et al.
patent: 6350664 (2002-02-01), Haji et al.
patent: 6780682 (2004-08-01), Pendse
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 6838316 (2005-01-01), Iizuka et al.
patent: 11-274241 (1999-10-01), None
patent: 11-297750 (1999-10-01), None
patent: 2001-176898 (2001-06-01), None

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