Flip chip type LED lighting device manufacturing method

Details Flip chip type LED lighting device manufacturing method Flip chip type LED lighting device manufacturing method

2005-01-06

2009-12-08

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S027000, C438S108000, C438S113000, C438S119000, C438S122000, C438S123000

Reexamination Certificate

active

07629188

ABSTRACT:
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

REFERENCES:
patent: 6936855 (2005-08-01), Harrah

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