Flip chip test structure

Details Flip chip test structure Flip chip test structure

2006-11-28

2006-11-28

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S761010

Reexamination Certificate

active

07141996

ABSTRACT:
A flip chip test structure is disclosed. The flip chip test structure utilizes a substrate used in flip chip package to replace the conventional transformer of a flip chip wafer probe card. The substrate-transformer replacement reduces the cost and simplifies the flip chip wafer probe card manufacturing process since the substrate is already available and matches the chip being tested while the transformer needs additional design and custom fabrication which are expensive and time-wasting for corresponding chip being tested.

REFERENCES:
patent: 5132613 (1992-07-01), Papae et al.
patent: 5477160 (1995-12-01), Love
patent: 5500605 (1996-03-01), Chang
patent: 5534784 (1996-07-01), Lum et al.
patent: 6033233 (2000-03-01), Haseyama et al.
patent: 6064217 (2000-05-01), Smith
patent: 6292003 (2001-09-01), Fredrickson et al.
patent: 6396292 (2002-05-01), Hembree et al.
patent: 6433410 (2002-08-01), Tanioka et al.
patent: 6541365 (2003-04-01), Edwards et al.
patent: 6690185 (2004-02-01), Khandros et al.
patent: 6720787 (2004-04-01), Kimura et al.
patent: 6984996 (2006-01-01), DiOrio et al.
patent: WO 02/15260 (2002-02-01), None

Affiliated with

Also associated with

Rating

Flip chip test structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip test structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip test structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3682109