Flip-chip test socket adaptor and method

Details Flip-chip test socket adaptor and method Flip-chip test socket adaptor and method

1989-03-30

1991-04-09

Wieder, Kenneth

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 725, 324158P, 439 68, 439 71, 357 67, G01R 107, G01R 104

Patent

active

050067923

ABSTRACT:
A test set socket adapter (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adapter (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.

REFERENCES:
patent: 3700788 (1972-10-01), Spinck
patent: 4433886 (1984-02-01), Cassarly et al.
patent: 4564251 (1986-01-01), Hansen et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4686468 (1987-08-01), Lee et al.
patent: 4739257 (1988-04-01), Jenson et al.
patent: 4770640 (1988-09-01), Walter
patent: 4791464 (1988-12-01), Ipri et al.
patent: 4809047 (1989-02-01), Temple

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