Flip-chip test socket adaptor and method

Details Flip-chip test socket adaptor and method Flip-chip test socket adaptor and method

1990-12-27

1991-12-17

Bradley, Paula A.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439912, 29593, 29832, H01R 909

Patent

active

050731173

ABSTRACT:
A test set socket adaptor (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adaptor (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.

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patent: 4906802 (1990-03-01), Castleman
patent: 5006792 (1991-04-01), Malhi et al.

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