Flip chip substrate design

Details Flip chip substrate design Flip chip substrate design

2006-09-05

2006-09-05

Owens, Douglas W (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000

Reexamination Certificate

active

07101734

ABSTRACT:
A chip device that includes a leadframe that has a die attach cavity. The memory device further includes a die that is placed within the die attach cavity. The die attach cavity is substantially the same thickness as the die. The die is positioned within the cavity and is attached therein with a standard die attachment procedure.

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