Flip chip solder bond structure for devices with gold based meta

Details Flip chip solder bond structure for devices with gold based meta Flip chip solder bond structure for devices with gold based meta

1991-04-12

1992-04-28

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

22826312, 437192, B23K 120

Patent

active

051080273

ABSTRACT:
A flip-chip solder bonding arrangement including a semiconductor substrate having thereon layers of metallization which have a tendency to interact with a solder material, forming on said layers of metallization a barrier metallization layer which is not reactive with said solder material, forming solder pads on the barrier layer and thereafter forming solder bonds with such solder pads employing said solder material.

REFERENCES:
patent: 3392442 (1968-07-01), Napier et al.
patent: 4273859 (1981-06-01), Mones et al.
patent: 4510514 (1985-04-01), Camlibel et al.
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4840302 (1989-06-01), Gardner et al.
patent: 4907734 (1990-03-01), Conru et al.
IBM Technical Disclosure Bulletin, "Stable Junctions . . . Diffusion Barriers", vol. 21, No. 4, p. 1753, Sep. 1978.

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