Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-12-11
1997-03-18
Ryan, Patrick
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156329, 1563798, 257778, 428447, 428356, 437209, 437212, C09J 400
Patent
active
056118848
ABSTRACT:
A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.
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Bearinger Clayton R.
Camilletti Robert C.
Haluska Loren A.
Kilby Jack S.
Michael Keith W.
DeCesare James L.
Dow Corning Corporation
Jewik Patrick R.
Ryan Patrick
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