Flip chip shielded RF I/O land grid array package

Details Flip chip shielded RF I/O land grid array package Flip chip shielded RF I/O land grid array package

2006-12-21

2009-11-24

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S678000, C257SE23114

Reexamination Certificate

active

07622793

ABSTRACT:
A novel apparatus and method for providing a radio frequency (“RF”) input/output (“I/O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings surrounding free-standing RF I/O interconnects. The free-standing RF I/O interconnects eliminate long leads and the shield rings provide ground protection thereby minimizing losses, inductance, leakage, and crosstalk, and improving performance.

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patent: 6870273 (2005-03-01), Tao et al.
Heinrich, Wolfgan, “The Flip-Chip Approach for Millimeter-Wave Packaging”, IEEE Microwave Magazine, Sep. 2005, pp. 36-45.

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