Flip chip semiconductor device including an unconnected...

Details Flip chip semiconductor device including an unconnected... Flip chip semiconductor device including an unconnected...

2011-03-08

2011-03-08

Pizarro, Marcos D (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S777000, C257SE23002, C257SE25022, C257SE21002, C438S109000

Reexamination Certificate

active

07902668

ABSTRACT:
A semiconductor chip constitutes a semiconductor device in which a plurality of semiconductor chips are laminated. The semiconductor chip includes a plurality of terminals which are to be connected to another semiconductor chip. At least one terminal of the terminals has a higher height than that of another terminal.

REFERENCES:
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patent: 2004/0245632 (2004-12-01), Nagarajan
patent: 2007/0069346 (2007-03-01), Lin et al.
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patent: 11040713 (1999-02-01), None
patent: 2001-339046 (2001-12-01), None
patent: 2005-183661 (2005-07-01), None
patent: 2006-332144 (2006-12-01), None
Japanese Office Action corresponding to U.S. Appl. No. 12/052,280 mailed on Jun. 12, 2009.
Japanese Office Action corresponding to U.S. Appl. No. 12/052,280 mailed on Jun. 29, 2009.

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