Flip chip packaging process employing improved probe tip design

Details Flip chip packaging process employing improved probe tip design Flip chip packaging process employing improved probe tip design

2006-03-07

2006-03-07

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000

Reexamination Certificate

active

07008818

ABSTRACT:
The present invention provides a novel probe tip suited for flip-chip packaging process. The probe tip comprises a needle body; and a stop cylinder having a recess for fittingly accommodating the needle body therein, the needle body being electrically connected to the stop cylinder via a resilient conductive material. The stop cylinder has an annual flat bottom surrounding the needle body for pressing a protruding probe mark on a metal pad scratched by the needle body.

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