Flip chip package with thermometer

Details Flip chip package with thermometer Flip chip package with thermometer

2005-12-06

2005-12-06

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S778000, C257S779000, C257S780000

Reexamination Certificate

active

06972489

ABSTRACT:
A flip chip package with a thermometer comprises a chip, a substrate, and a thermocouple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump pads disposed on the region, corresponding to the bumps, and electrically connected to the bumps. Each of the thermocouples comprises a thermal contact which is disposed between the substrate and one of the bumps of the chip.

REFERENCES:
patent: 6126059 (2000-10-01), MacKay et al.
patent: 6188044 (2001-02-01), Lee et al.
patent: 6196002 (2001-03-01), Newman et al.
patent: 6570250 (2003-05-01), Pommer
patent: 2003/0047807 (2003-03-01), Alcoe et al.
patent: 2004/0065880 (2004-04-01), Hunt et al.

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