Flip chip package with reduced thermal stress

Details Flip chip package with reduced thermal stress Flip chip package with reduced thermal stress

2007-02-13

2007-02-13

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257S618000, C257S619000, C257S778000, C257S797000, C438S462000, C438S113000

Reexamination Certificate

active

11161171

ABSTRACT:
A flip-chip package includes a packaging substrate; an integrated circuit die affixed to the packaging substrate, wherein the integrated circuit die includes an active integrated circuit surrounded by a peripheral die seal ring therein; and a thermal stress releasing pad disposed in a stress-releasing area that is at a corner of the integrated circuit die outside the die seal ring, wherein the thermal stress releasing pad is connected to the packaging substrate by using a solder bump, which, in turn, is connected to a dummy heat-spreading metal plate embedded in the packaging substrate so as to form a heat shunting path for reducing thermal stress during temperature cycling test.

REFERENCES:
patent: 5336918 (1994-08-01), Ipposhi et al.
patent: 5831330 (1998-11-01), Chang
patent: 5977639 (1999-11-01), Seshan et al.
patent: 6022791 (2000-02-01), Cook et al.
patent: 6204557 (2001-03-01), Lien et al.
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6876064 (2005-04-01), Matumoto et al.
patent: 2005/0263855 (2005-12-01), Fu et al.
patent: 2005/0280120 (2005-12-01), Tomita
patent: 2006/0012012 (2006-01-01), Wang et al.
patent: 2006/0163699 (2006-07-01), Kumakawa et al.

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