Flip chip package with reduced number of package layers

Details Flip chip package with reduced number of package layers Flip chip package with reduced number of package layers

1996-03-20

1997-11-11

Thomas, Tom

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carbohydrate or derivative as a reactant

257700, 257691, 257698, H01L 23498, H01L 23482, H05K 118, H05K 702

Patent

active

056867646

ABSTRACT:
A flip chip substrate includes first and second conductive layers, and a dielectric layer interposed therebetween. Each conductive layer includes a repeating pattern of a group of I/O signal traces such as two I/O signal traces, followed by a wider power or ground trace. The I/O traces on one conductive layer lie atop or below power or ground traces on the other conductive layer. The wider power and ground traces provide shielding on either side of the I/O trace group, as well as above or below.

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