Flip-chip package covered with tape

Details Flip-chip package covered with tape Flip-chip package covered with tape

2008-02-01

2010-12-07

Sefer, A. (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C257S701000, C264S272110, C264S272170, C264S272130

Reexamination Certificate

active

07846780

ABSTRACT:
A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.

REFERENCES:
patent: 5858149 (1999-01-01), Seo et al.
patent: 2003/0011077 (2003-01-01), Morishima et al.
patent: 2003/0027371 (2003-02-01), Sunagawa et al.
patent: 2006/0163750 (2006-07-01), Kaneko

Affiliated with

Also associated with

Rating

Flip-chip package covered with tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip package covered with tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip package covered with tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4178249