Flip chip package and process of forming the same

Details Flip chip package and process of forming the same Flip chip package and process of forming the same

2006-10-31

2006-10-31

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

C438S462000

Reexamination Certificate

active

07129146

ABSTRACT:
A flip chip package and a process of forming the same are disclosed. After aligning a chip on a circuit substrate according to the fiducial marks formed on the circuit substrate, a barrier material block is disposed on each of the fiducial marks. Thereafter, a fixing treatment, such a reflow or a curing treatment, is performed to transform the barrier material blocks into barrier layers for covering the fiducial marks respectively. The barrier layers are adapted for resisting exposure of fiducial marks from external air or moisture to reduce the possibility of fiducial marks from being oxidized. Thus, the reliability and the aesthetic appearance of the flip chip package can be effectively promoted.

REFERENCES:
patent: 6278193 (2001-08-01), Coico et al.
patent: 7005754 (2006-02-01), Howarth
patent: 2005/0014348 (2005-01-01), Rumsey et al.

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