Flip chip-on-flip chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

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257778, H01L 2348

Patent

active

059145358

ABSTRACT:
A multi-chip module that incorporates multiple flip chip (16) mounted on a daughter board (12), which in turn is flip-chip mounted onto a product mother board (10). The daughter board (12) is preferably a silicon substrate having solder bump terminals (14) and at least one conductor pattern on a surface thereof. The surface of the daughter board (12) may also have conductive runners and any passive electronic components required by the module. Mounted to the conductor pattern of the daughter board (12) are the flip chips (16) having solder bump terminals (18) that are registered and soldered to the conductor pattern of the daughter board (12). The solder bump terminals (14) of the daughter board (12) are then registered and soldered to a complementary conductor pattern on the mother board (10), such that the flip chips (16) are disposed between the daughter board (12) and the mother board (10).

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patent: 5751060 (1998-05-01), Laine et al.

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