Flip chip-on-flip chip multi-chip module

Details Flip chip-on-flip chip multi-chip module Flip chip-on-flip chip multi-chip module

1998-01-16

1999-06-22

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257778, H01L 2348

Patent

active

059145358

ABSTRACT:
A multi-chip module that incorporates multiple flip chip (16) mounted on a daughter board (12), which in turn is flip-chip mounted onto a product mother board (10). The daughter board (12) is preferably a silicon substrate having solder bump terminals (14) and at least one conductor pattern on a surface thereof. The surface of the daughter board (12) may also have conductive runners and any passive electronic components required by the module. Mounted to the conductor pattern of the daughter board (12) are the flip chips (16) having solder bump terminals (18) that are registered and soldered to the conductor pattern of the daughter board (12). The solder bump terminals (14) of the daughter board (12) are then registered and soldered to a complementary conductor pattern on the mother board (10), such that the flip chips (16) are disposed between the daughter board (12) and the mother board (10).

REFERENCES:
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5424245 (1995-06-01), Gurtler et al.
patent: 5557149 (1996-09-01), Richards et al.
patent: 5614766 (1997-03-01), Takasu et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5729440 (1998-03-01), Jimarez et al.
patent: 5751060 (1998-05-01), Laine et al.

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