Flip chip-on-flip chip multi-chip module

Details Flip chip-on-flip chip multi-chip module Flip chip-on-flip chip multi-chip module

1997-02-10

1998-06-23

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438109, 438613, 438615, H01L 2144, H01L 2148, H01L 2150

Patent

active

057704775

ABSTRACT:
A multi-chip module that incorporates multiple flip chip (16) mounted on a daughter board (12), which in turn is flip-chip mounted onto a product mother board (10). The daughter board (12) is preferably a silicon substrate having solder bump terminals (14) and at least one conductor pattern on a surface thereof. The surface of the daughter board (12) may also have conductive runners and any passive electronic components required by the module. Mounted to the conductor pattern of the daughter board (12) are the flip chips (16) having solder bump terminals (18) that are registered and soldered to the conductor pattern of the daughter board (12). The solder bump terminals (14) of the daughter board (12) are then registered and soldered to a complementary conductor pattern on the mother board (10), such that the flip chips (16) are disposed between the daughter board (12) and the mother board (10).

REFERENCES:
patent: 5424245 (1995-06-01), Gurtler et al.

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