Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1998-06-04
2000-12-05
Gaffin, Jeffrey
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174260, 174262, 361719, H05K 100
Patent
active
061569801
ABSTRACT:
A circuit structure and method for conducting heat from a power flip chip. Heat is dissipated from a flip chip mounted to a PCB by conducting heat through conductive vias to the opposite surface of the PCB. The flip chip is equipped with two sets of solder bumps, one of which is registered with conductors on the PCB, while the second is registered with a thermal conductor layer on the PCB surface and electrically isolated from the conductors. A second thermal conductor layer on the opposite surface of the PCB contacts the vials, such that heat is conducted from the flip chip to the second thermal conductor layer through the second set of solder bumps, the first thermal conductor layer, and the conductive vias. A heatsink is embedded in the PCB between the vias and the second thermal conductor layer to further promote heat conduction away from the flip chip. Heat can be conducted from the PCB with a second heatsink, such as a housing that encloses the PCB. The second heatsink either directly contacts the second thermal conductor layer, or makes thermal contact with the second thermal conductor layer through a thermally-conductive lubricant or adhesive.
REFERENCES:
patent: 5352926 (1994-10-01), Andrews
patent: 5710071 (1998-01-01), Beddingford et al.
patent: 5777386 (1998-07-01), Higashi et al.
patent: 5969461 (1999-06-01), Aderson et al.
patent: 5973927 (1999-10-01), Tanaka
Berndt Joanna Christine
Myers Bruce Alan
Peugh Darrel Eugene
Cuneo Kamand
Delco Electronics Corp.
Funke Jimmy L.
Gaffin Jeffrey
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