Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-03-13
2010-06-01
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S248100, C438S613000
Reexamination Certificate
active
07726545
ABSTRACT:
A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
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Fujii Toshio
Hirano Koichi
Ichiryu Takashi
Karashima Seiji
Nakatani Seiichi
Gamino Carlos
Panasonic Corporation
Ward Jessica L.
Wenderoth , Lind & Ponack, L.L.P.
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