Flip chip mounting method which avoids void formation...

Details Flip chip mounting method which avoids void formation... Flip chip mounting method which avoids void formation...

2005-01-11

2005-01-11

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S127000, C438S612000, C438S613000

Reexamination Certificate

active

06841415

ABSTRACT:
The present invention is to provide a flip chip mounting method which does not cause void formation between a semiconductor chip and a substrate, and in the flip chip mounting method, the method comprising the steps of: (A) drying the substrate; and (B) at least one step of: (1) dispensing uncured sealant at least at a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present; and (2) performing a pressing and the curing of the underfill while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate does not cause convection substantially in the uncured or curing underfill.

REFERENCES:
patent: 5994165 (1999-11-01), Yoshino et al.
patent: 6069024 (2000-05-01), Murakami
patent: 6410415 (2002-06-01), Estes et al.
patent: 6420213 (2002-07-01), Nakajyo et al.
patent: 7-312377 (1995-11-01), None
patent: 8-337635 (1996-12-01), None
patent: 10-223686 (1998-08-01), None
patent: 2000-156560 (2000-06-01), None
English language International Preliminary Examination Report issued in International Application No. PCT/JP01/03183 filed Apr. 13, 2001 (the International application corresponds to the present application).

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