Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-01-25
2011-01-25
Vu, David (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S597000, C438S107000, C257S778000, C257S789000, C257S787000, C257S737000, C257S795000
Reexamination Certificate
active
07875496
ABSTRACT:
A flip chip mounting method includes holding a circuit board (213) and a semiconductor chip (206), aligning the circuit board (213) with the semiconductor chip (206) while holding them with a predetermined gap therebetween, heating the circuit board (213) or the semiconductor chip (206) to a temperature at which solder powder in a solder resin composition (216) formed of solder powder (214) and a resin (215) is melted, supplying the solder resin composition (216) by a capillary phenomenon, and curing the resin (215), wherein the melted solder powder (214) in the solder resin composition (216) is moved through the predetermined gap across which the circuit board (213) and the semiconductor chip (206) are held, and self-assembled and grown, whereby the connection terminals (211) and the electrode terminals (207) are connected to each other electrically. According to this configuration, a flip chip mounting method having high productivity and reliability, which enables a next generation semiconductor chip to be mounted on a circuit board, a mounted body thereof, and a mounting apparatus thereof are provided.
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Chinese Office Action, dated Sep. 19, 2008.
Ichiryu Takashi
Karashima Seiji
Kitae Takashi
Nakatani Seiichi
Yamashita Yoshihisa
Hamre Schumann Mueller & Larson P.C.
Panasonic Corporation
Pathak Shantanu C
Vu David
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