Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-09-19
2010-06-08
Sarkar, Asok K (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21001
Reexamination Certificate
active
07732255
ABSTRACT:
In a flip shop mounting method by a no-flow underfill in which resin is pre-coated on a substrate52, and, thereafter, a semiconductor50with bump is mounted on the substrate52to join a pad electrode53on the substrate52to the bump51, a resin54ahighly filed with the filler55is applied to a region except for the pad electrode53on the substrate52, a resin54bbeing free from the filler is applied to a pad electrode53portion on the substrate52, and, thereafter, the semiconductor50with bump is mounted at a predetermined position on the substrate52.
REFERENCES:
patent: 6674172 (2004-01-01), Vincent
patent: 7279359 (2007-10-01), Chen et al.
patent: 10-125724 (1998-05-01), None
patent: 2001-053109 (2001-02-01), None
Matsumoto Hirofumi
Mori Takashi
Uemura Naruhiko
Fattibene Paul A.
Fattibene and Fattibene
Nippon Mektron Ltd.
Sarkar Asok K
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