Flip-chip mounting assembly and method with vertical wafer feede

Details Flip-chip mounting assembly and method with vertical wafer feede Flip-chip mounting assembly and method with vertical wafer feede

1995-10-30

1997-09-30

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

294263, 294264, 294265, 29703, 29742, 29743, 29759, 29760, 294 641, 414225, 414417, 414737, 414752, 414938, 414939, 901 40, H05K 330, H05K 1302, H05K 1304, H05K 1308

Patent

active

056715307

ABSTRACT:
A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.

REFERENCES:
patent: 3657790 (1972-04-01), Larrison
patent: 4836733 (1989-06-01), Hertel et al.
patent: 4915565 (1990-04-01), Bond et al.
patent: 4955775 (1990-09-01), Ohkase et al.
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5180273 (1993-01-01), Sakaya et al.
patent: 5193972 (1993-03-01), Engelbrecht
patent: 5319846 (1994-06-01), Takahashi et al.

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