Flip chip mounted diode

Details Flip chip mounted diode Flip chip mounted diode

1979-03-14

1981-02-10

James, Andrew J.

Wave transmission lines and networks

Automatically controlled systems

With control of equalizer and/or delay network

357 69, 357 71, 357 80, 333247, H01L 2348, H01L 2944, H01L 2952

Patent

active

042505208

ABSTRACT:
A planar semiconductor device having a cathode region surrounding an anode region is flip chip mounted to a conductor film circuit. An anode contact extends from the anode region and is bonded to a first portion of the conductor film circuit such that that portion of the cathode region which overlaps the first portion of the conductor film circuit is minimized. That portion of the cathode region distal from the anode region is relatively wide, and a relatively large area cathode contact extends from the cathode region and is bonded to a second portion of the conductor film circuit.

REFERENCES:
patent: 3254274 (1966-05-01), Garcia et al.
patent: 3404214 (1968-10-01), Elliott
patent: 3711778 (1973-01-01), Day
patent: 3768050 (1973-10-01), Stiles
patent: 3774123 (1973-11-01), Hume
patent: 3967296 (1976-06-01), Intrator
patent: 4009456 (1977-02-01), Hopfer
patent: 4048438 (1977-09-01), Zimmerman
patent: 4127830 (1978-11-01), Chalifour et al.

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