Flip chip module

Details Flip chip module Flip chip module

1987-03-30

1989-02-14

James, Andrew J.

357 80, 357 79, 357 81, H01L 21447, H01L 2312, H01L 2304

Patent

active

048050075

ABSTRACT:
A flip chip module including a film having solder receptor pads and interconnect lines to which a plurality of electronic devices and the like are bonded. The film is folded at predetermined areas thereby decreasing the size of this multichip device. A removable heat radiating cover is disposed over the film. This cover allows for both heat dissipation and easy access internal components for both testing and replacement after the flip chip module has been assembled.

REFERENCES:
patent: 3239719 (1966-03-01), Shower
patent: 4007479 (1977-02-01), Kowalski
patent: 4338621 (1982-07-01), Braun
patent: 4563725 (1986-01-01), Kirby
patent: 4692790 (1987-09-01), Oyamada

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