Flip-chip micromachine package using seal layer

Details Flip-chip micromachine package using seal layer Flip-chip micromachine package using seal layer

2005-01-04

2005-01-04

Tokar, Michael (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

06838309

ABSTRACT:
A micromachine package includes a micromachine chip having a front surface and a micromachine area on the front surface. The micromachine package further includes a substrate having at least one vent extending through the substrate. A seal layer extends between the front surface of the micromachine chip and an upper surface of the substrate. The vent extends to the seal layer directly opposite of a cavity defined by an upper surface of the seal layer and the front surface of the micromachine chip. The micromachine area is located within the cavity.

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