Flip chip microfuse

Details Flip chip microfuse Flip chip microfuse

1993-10-27

1994-11-08

Donovan, Lincoln

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337231, 337260, H01H 85143

Patent

active

053630823

ABSTRACT:
A flip chip Surface Mount Fuse is disclosed. This fuse is comprised of a generally rectangular insulating member having a groove across its full length. A fuse element is placed inside the elongated groove and thick film metallizations are provided, through printing techniques, on opposite sides of the insulating member inside the groove to secure the fuse element and to provide termination to the insulating member. The opening of the groove is filled with an electrically insulating coating. The coating can be applied to form a time delay fuse or a fast acting fuse. Fuses can be manufactured in any desired size.

REFERENCES:
patent: 3500276 (1970-03-01), Hingorany
patent: 4547830 (1985-10-01), Yamauchi
patent: 4563666 (1986-01-01), Borzoni
patent: 4608548 (1986-08-01), Borzoni
patent: 4612529 (1986-09-01), Gurevich et al.
patent: 4873506 (1989-10-01), Gurevich
patent: 5130688 (1992-07-01), Van Rietschoten et al.
patent: 5140295 (1992-08-01), Vermot-gaud et al.
patent: 5166656 (1992-11-01), Badihi et al.

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