Flip chip metallization

Details Flip chip metallization Flip chip metallization

1997-04-02

1999-05-18

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 13, 216 95, 216105, 216100, 252 795, 438754, H01B13/00

Patent

active

059048590

ABSTRACT:
The specification describes techniques for applying under bump metallization (UBM) for solder bump interconnections on interconnection substrates. The UBM of the invention comprises a Cu, Cu/Cr, Cr multilayer structure. Problems in etching the Cu/Cr layer are overcome using a high pH etchant containing a copper complexing ingredient to prevent passivation of the copper constituent by the chromium etchant solution. With the availability of this etchant the UBM multilayer can be formed using subtractive techniques.

REFERENCES:
patent: 3809588 (1974-05-01), Zeblisky
patent: 4396900 (1983-08-01), Hall
patent: 4434434 (1984-02-01), Bhattacharya et al.
patent: 4747907 (1988-05-01), Acocella et al.
patent: 5503286 (1996-04-01), Nye, III et al.

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