Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2008-04-15
2008-04-15
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257S778000
Reexamination Certificate
active
11002797
ABSTRACT:
Provided are a flip-chip light emitting diode (FCLED) and a method of manufacturing the same. The provided FCLED is formed by sequentially depositing an n-type cladding layer, an active layer, a p-type cladding layer, and a reflective layer on a substrate. The reflective layer is formed of the alloy of silver to which a solute element is added. According to the provided FCLED and the method of manufacturing the same, a thermal stability is improved to improve an ohmic contact characteristic to a p-type cladding layer, thus a wire bonding efficiency and a yield are improved when packaging the provided FCLED. In addition, the light emitting efficiency and the lifespan of the provided FCLED are improved due to a low specific-contact resistance and an excellent current-voltage characteristic.
REFERENCES:
patent: 7205576 (2007-04-01), Song et al.
patent: 2002/0171087 (2002-11-01), Krames et al.
patent: 2003/0205712 (2003-11-01), Bhat et al.
patent: 2006/0081867 (2006-04-01), Kim et al.
patent: 0 733 931 (1996-09-01), None
patent: 11-191641 (1999-07-01), None
patent: 2000-164928 (2000-06-01), None
patent: 2002-151739 (2002-05-01), None
Korean Office Action dated Oct. 27, 2005.
Official Action issued by the Patent Office of the People's Republic of China in corresponding Chinese Patent Application No. 200410103926.X; Mar. 9, 2007; and English translation thereof.
Leem Dong-seok
Seong Tae-yeon
Song June-o
Buchanan & Ingersoll & Rooney PC
Clark S. V.
Gwangju Institute of Science and Technology
LandOfFree
Flip-chip light emitting diode and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flip-chip light emitting diode and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip light emitting diode and method of manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3913136