Flip-chip interconnection having enhanced electrical connections

Details Flip-chip interconnection having enhanced electrical connections Flip-chip interconnection having enhanced electrical connections

1997-03-18

1999-09-14

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257778, 257780, 257696, H01L 2348, H01L 2940

Patent

active

059527277

ABSTRACT:
One-side ends of fine metal wires are bonded onto pads of a semiconductor chip via wire bonding and the other ends of the fine metal wires are mounted on the board by flip chip.

REFERENCES:
patent: 5189507 (1993-02-01), Carlomagno et al.
patent: 5719440 (1998-02-01), Moden
patent: 5742100 (1998-04-01), Schroeder et al.

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