Flip chip in leaded molded package with two dies

Details Flip chip in leaded molded package with two dies Flip chip in leaded molded package with two dies

2006-04-18

2006-04-18

Booth, Richard (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S111000, C438S112000, C438S127000

Reexamination Certificate

active

07029947

ABSTRACT:
A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second die is coupled to a second side of the leadframe with solder. A molded body surrounds at least a portion of the leadframe and the dies.

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