Flip-chip having electrical contact pads on the backside of the

Details Flip-chip having electrical contact pads on the backside of the Flip-chip having electrical contact pads on the backside of the

1999-01-08

2000-06-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361768, 361792, 257690, 257698, 257700, 257702, 257723, 257724, 257773, 257777, 257784, 174255, 174256, 438125, H05K 702

Patent

active

060757124

ABSTRACT:
An integrated circuit device. The integrated circuit device includes a semiconductor substrate having a first surface and a second surface opposite the first surface. Circuit elements are formed within the first surface. A plurality of bump contacts are located on the first surface and connected to the circuit elements. Bond pads that are also connected to circuit elements are located within or on the second surface.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 5032896 (1991-07-01), Little et al.
patent: 5436197 (1995-07-01), Hause
patent: 5514613 (1996-05-01), Santadrea et al.
patent: 5640049 (1997-06-01), Rostoker et al.
patent: 5731223 (1998-03-01), Padmanabhan
patent: 5825080 (1998-10-01), Imaoka et al.

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