Flip chip bonding tool and ball placement capillary

Details Flip chip bonding tool and ball placement capillary Flip chip bonding tool and ball placement capillary

2006-10-24

2006-10-24

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S006100, C228S180500

Reexamination Certificate

active

07124927

ABSTRACT:
A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.

REFERENCES:
patent: 2892924 (1959-06-01), Wood
patent: 3538205 (1970-11-01), Gates, Jr. et al.
patent: 3563443 (1971-02-01), Perdotti et al.
patent: 3660050 (1972-05-01), Iler et al.
patent: 3917148 (1975-11-01), Runyon
patent: 3938722 (1976-02-01), Kelly et al.
patent: 3971499 (1976-07-01), Goodrich, Jr. et al.
patent: 3986255 (1976-10-01), Mandal
patent: 3986653 (1976-10-01), Gilding
patent: 4020543 (1977-05-01), Pennings
patent: 4050762 (1977-09-01), Hines et al.
patent: 4157932 (1979-06-01), Hirata
patent: 4171477 (1979-10-01), Funari
patent: 4182947 (1980-01-01), Brower
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4331048 (1982-05-01), Dworak et al.
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4405074 (1983-09-01), Levintov et al.
patent: 4502983 (1985-03-01), Omori et al.
patent: 4513190 (1985-04-01), Ellett et al.
patent: 4554033 (1985-11-01), Dery et al.
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4686465 (1987-08-01), Kruger
patent: 4691854 (1987-09-01), Haefling et al.
patent: 4705204 (1987-11-01), Hirota et al.
patent: 4772498 (1988-09-01), Bertin et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 4842662 (1989-06-01), Jacobi
patent: 4897710 (1990-01-01), Suzuki et al.
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4909427 (1990-03-01), Plaisted et al.
patent: 4974767 (1990-12-01), Alfaro et al.
patent: 4998002 (1991-03-01), Okikawa et al.
patent: 5123935 (1992-06-01), Kanamaru et al.
patent: 5144747 (1992-09-01), Eichelberger
patent: 5178742 (1993-01-01), Lemke et al.
patent: 5180093 (1993-01-01), Stansbury et al.
patent: 5214259 (1993-05-01), Terakado et al.
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5280979 (1994-01-01), Poli et al.
patent: 5290507 (1994-03-01), Runkle
patent: 5341979 (1994-08-01), Gupta
patent: 5347086 (1994-09-01), Potter et al.
patent: 5367956 (1994-11-01), Fogle, Jr.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5427301 (1995-06-01), Pham et al.
patent: 5437405 (1995-08-01), Asanasavest
patent: 5463197 (1995-10-01), Miyazaki
patent: 5491605 (1996-02-01), Hughbanks et al.
patent: 5527441 (1996-06-01), Offer
patent: 5544804 (1996-08-01), Test et al.
patent: 5558270 (1996-09-01), Nachon et al.
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5616257 (1997-04-01), Harada et al.
patent: 5649355 (1997-07-01), Offer
patent: 5651901 (1997-07-01), Mohri et al.
patent: 5662261 (1997-09-01), Fogal
patent: 5669545 (1997-09-01), Pham et al.
patent: 5676856 (1997-10-01), Haji et al.
patent: 5797388 (1998-08-01), Nakamura et al.
patent: 5816472 (1998-10-01), Linn
patent: 5827470 (1998-10-01), Chatterjee et al.
patent: 5871141 (1999-02-01), Hadar et al.
patent: 5931368 (1999-08-01), Hadar et al.
patent: 5984162 (1999-11-01), Hortaleza et al.
patent: 6030472 (2000-02-01), Hajaligol et al.
patent: 6041995 (2000-03-01), Takahashi et al.
patent: 6053777 (2000-04-01), Boyle
patent: 6073827 (2000-06-01), Razon et al.
patent: 6219911 (2001-04-01), Estes et al.
patent: 6325269 (2001-12-01), Suzuki et al.
patent: 6337522 (2002-01-01), Kang et al.
patent: 6354479 (2002-03-01), Reiber et al.
patent: 6646355 (2003-11-01), Kang et al.
patent: 6651864 (2003-11-01), Reiber et al.
patent: 6759642 (2004-07-01), Hoshino
patent: 6905350 (2005-06-01), Wallash et al.
patent: 6935548 (2005-08-01), Reiber
patent: 2005/0109814 (2005-05-01), Reiber
patent: 2005/0109817 (2005-05-01), Reiber
patent: 0435423 (1991-07-01), None
patent: 2287897 (1995-10-01), None
patent: 54037114 (1979-03-01), None
patent: 63164228 (1988-07-01), None
patent: 63-239959 (1988-10-01), None
patent: 02-67741 (1990-03-01), None
patent: 04-149065 (1992-05-01), None
patent: 04-149605 (1992-05-01), None
patent: 06-45389 (1994-02-01), None
patent: 09-162223 (1997-06-01), None
patent: 11-186315 (1999-07-01), None
patent: 11-251357 (1999-09-01), None
patent: 2001-201515 (2001-07-01), None
patent: 2001-351934 (2001-12-01), None
Stan Weitz, “Trends in ESD Test Methods,” Materials Testing Section of the ETS Testing Laboratory, Electrotech Systems, 1998, pp. 1-7.
Instrument FAQs, Drivers, Libraries and Examples, Keithley Instrument Model 6517/6517A, Keithley Instruments, Inc., 1999, pp. 1-2.
Keithley Instruments Model 6517A Electrometer/High Resistance Meter, Keithley Instruments, Inc., pp. 1-9, date unknown.
“Low-Current/High-Resistance Meters,” Keithley Instruments Model 6517A, Keithley Instruments, Inc. pp. 112-115, date unknown.
Keytech 200 XV-2 ESD Simulator, Kandus Equipment, p. 1, date unknown.
Newburg, Carl E., “Test Report”, Anza Technology, Incorporated Static Dissipative Ceramic Rods . . . , Report 190:2000-92, River's Edge Technical Service, Nov. 29, 2000, pp. 1-5.
Huntsman, James et al., “Test Methods for Static Control Products,” Electrical Overstress/Electrostatic Discharge Sym., Sep. 21, 1982, pp. 94-109, vl.4, IIT Rsrch Inst.
Mayer, Michael et al., “Active Test Chips for In Situ Wire Bonding Process Characterization,” Semicon Singapore 2001, May 2001.
National Semiconductor, “Semiconductor Packaging Assembly Technology,” Aug. 1999.
Suman et al., “Wire Bond Temperature Sensor,” IMAPS International Symposium on Microelectronics, Baltimore, MD, Oct. 9-11, 2001.
Klossner, et al., “An Integrated Approach to Solving sub-45um Wire Bond Process Challenges,” SEMICON Singapore, 2001.
Wilson, et al. “Holographic Interferometry Applied to Motion Studies of Ultrasonic Bonders,” IEEE Transactions on Sonics and Ultrasonics, vol. 19, No. 4, Oct. 1972.
Olney et al., “A New ESD Model: The Charged Strip Model,” EOS/ESD Symposium Proceedings, 2002.
Andres et al., “Bumping Wafers via Ultrasonically Enhanced Stencil Printing,” SEMICON West 2003.
Jittinorasett, Suwanna, “UBM Formation on Single Die/Dice for Flip Chip Applications,” Aug. 1999.
Zakel, et al., “Laser Solder Attach for Optoelectronic Packages,” Proceedings of the PhoPack Conference (Stanford University, California), Jul. 2002.
PacTech Packaging Technologies, “Laser Solder Ball Jet System,” www.pactech-usa.com, date unknown.

Affiliated with

Also associated with

Rating

Flip chip bonding tool and ball placement capillary does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip bonding tool and ball placement capillary, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip bonding tool and ball placement capillary will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3719536